Display apparatus

ABSTRACT

A display apparatus includes a frame, a panel module and an adjusting pad. The frame has a supporting surface, and the panel module includes a substrate and a plurality of chips. The substrate is disposed on the supporting surface and has a bonding region at a side of the substrate. The chips are disposed on the bonding region, wherein the chips and the supporting surface are located at two opposite surfaces of the substrate. The adjusting pad is disposed between the supporting surface and the bonding region, and the thickness of the adjusting pad is gradually reduced from a center portion of the adjusting pad toward two sides of the adjusting pad. Another display apparatus, in which a frame and an adjusting pad are integrated into one piece, is provided.

TECHNICAL FIELD

The invention relates to a display apparatus, in particularly to a flatpanel display.

BACKGROUND

As the manufacturing technology of flat panel displays is more mature,traditional CRT displays have been replaced by the flat panel displays.Currently, typical flat panel displays include liquid crystal displays(LCDs), plasma displays (PDPs), electrophoretic displays and organiclight emitting displays (OLEDs). Among these displays, the LCDs have themost popularity.

For satisfying needs of consumers, the LCDs with wide viewing angle andlow color shifting have become the mainstream of market. The currentlyoften used wide viewing angle technologies include in plane switching(IPS) and advanced hyper viewing angle (AHVA). However, during themanufacturing of the LCD devices, high heat and high pressure are neededto bond driver chips to the glass substrate of the LCD panel, in such astep, the glass substrate can easily be deformed to bend, which causesabnormal light leakage while the LCD device is in a normally black mode.

SUMMARY

An embodiment of the invention provides a display apparatus including aframe, a panel module and an adjusting pad. The frame has a supportingsurface. The panel module includes a substrate and a plurality of chips.The substrate is disposed on the supporting surface and the substratehas a bonding region at a side thereof. The chips are disposed on thebonding region. The chips and the bonding region are located on thesupporting surface. The chips and the supporting surface arerespectively located at two opposite surfaces of the substrate. Theadjusting pad is disposed between the supporting surface and the bondingregion. The thickness of the adjusting pad is gradually reduced from thecenter toward the two sides thereof.

Another embodiment of the invention provides a display apparatusincluding a frame and a panel module. The frame has a supporting surfaceand a first adjusting pad protruding from the supporting surface. Thepanel module includes a substrate and a plurality of chips. Thesubstrate is disposed on the supporting surface and the substrate has abonding region at a side thereof. The first adjusting pad is locatedbelow the bonding region. The chips are disposed on the bonding region.The chips and the supporting surface are respectively located at twoopposite surfaces of the substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will become more readily apparent to thoseordinarily skilled in the art after reviewing the following detaileddescription and accompanying drawings, in which:

FIG. 1 is a schematic cross sectional view of a display apparatusaccording to an embodiment of the invention.

FIG. 2 is a schematic top view of a panel module in FIG. 1.

FIG. 3A and FIG. 3B are schematic views showing the panel module isdisposed on the supporting surface of the frame.

FIG. 4 is a schematic view of a display apparatus according to anotherembodiment of the invention.

FIG. 5 is a schematic view of a display apparatus according to anotherembodiment of the invention.

FIG. 6 is a schematic view showing a frame and a second adjusting frameof a display apparatus according to another embodiment of the invention.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

The present invention will now be described more specifically withreference to the following embodiments. It is to be noted that thefollowing descriptions of preferred embodiments of this invention arepresented herein for purpose of illustration and description only. It isnot intended to be exhaustive or to be limited to the precise formdisclosed.

FIG. 1 is a schematic cross sectional view of a display apparatusaccording to an embodiment of the invention. FIG. 2 is a schematic topview of a panel module in FIG. 1. Referring to FIG. 1 and FIG. 2, thedisplay apparatus 100 includes a frame 110 and a panel module 120. Theframe 110 has a supporting surface 112, and the panel module 120 has asubstrate 122 and a plurality of chips 124. The substrate 122 isdisposed on the supporting surface 112, and the substrate 122 has abonding region 123 at a side thereof. The chips 124 are disposed on thebonding region 123. The chips 124 and the bonding region 123 aredisposed above the supporting surface 112. The chips 124 and supportingsurface 112 are respectively located at above and below of the substrate122. In this embodiment, the material of the substrate 122 is, forexample, glass, but not limited thereto. The substrate 122, for example,includes an active device array (such like a thin film transistorarray). The panel module 120 can further include another substrate 126disposed on the substrate 122. The panel module 120 has the function ofdisplaying images and can be a liquid crystal display module, an organiclight emitting display module, an eletrophoretic display module and anelectrowetting display module, but not limited thereto.

Since the substrate 122 is easily deformed flexure when the chips 124 isbeing bonded to the bonding region 123, the display apparatus 100 ofthis embodiment further includes an adjusting pad 130 disposed betweenthe supporting surface 112 and the bonding region 123 for solving theproblem of the flexure of the substrate 122. The adjusting pad 130 ofthis embodiment is detailed below.

FIG. 3A and FIG. 3B are schematic views showing the panel module isdisposed on the supporting surface of the frame. In the drawings, onlythe substrate 122 and the chips 124 are used to represent the panelmodule 120, and the supporting surface 112 is used to represent theframe 110. As FIG. 3A shows, the adjusting pad 130 of the embodiment isused for leveling the flexural substrate 122. Since after the chips 124are bonded to the substrate 122, the substrate 122 is affected by stressand is deformed to a shape that the center portion is downwardly bended.Accordingly, the thickness of the adjusting pad 130 is gradually reducedfrom the center toward the two sides thereof. In other words, thethickness variation of the adjusting pad 130 can be adjusted accordingto the degree of the flexure of the substrate 122.

The manner of how to make the thickness of the adjusting pad graduallyreduce from the center toward the two sides of the invention is notlimited. In this embodiment, the adjusting pad 130 has a plurality ofbase materials (such as a first base material 131, a second basematerial 132 and a third base material 133) stacked with each other forforming the adjusting pad 130 with the thickness gradually reducing fromthe center toward the two sides. These base materials are such likeadhesive tapes, but not limited thereto. These base materials of theadjusting pad 130 are, for example, stripe shaped and sequentiallystacked, wherein the second base material 132 is disposed on the firstbase material 131, and the third base material 133 is disposed on thesecond base material 132. The thickness of each of the base material isdetermined according to the degree of the flexure of the substrate 122.Generally speaking, the thickness of the base material is, for example,0.0025 mm to 0.05 mm, but not limited thereto. The base material can becompressible material such as foam, or can be incompressible materialsuch as polyethylene terephthalate (PET).

Following the above mentioned, for any two of the adjacent basematerials, the length of the under base material is longer than thelength of the upper base material. In other words, the length of thefirst base material 131 is longer than the length of the second basematerial 132, and the length of the second base material 132 is longerthan the length of the third base material 133. Besides, for any twoadjacent substrates, two side of the under base material has regionswhich are not overlapped by the upper substrate. And the regions havethe same dimensions. That is, the two regions A1, A2 of the first basematerial 131 which are not overlapped by the second base material 132have the same dimensions. The two regions A3, A4 of the second basematerial 132 which are not overlapped by the third base material 133have the same dimensions.

The first base material 131 has a first surface S1 and a second surfaceS2 opposite to each other. The second base material 132 has a thirdsurface S3 and a fourth surface S4 opposite to each other. The thirdbase material 133 has a fifth surface S5 and a sixth surface S6 oppositeto each other. The first surface S1 is adhesive and is attached to thesupporting surface 112. The second surface S2 is adhesive, and the thirdsurface S3 is attached to the second surface S2. The fourth surface S4and the sixth surface S6 are nonadhesive. The fifth surface S5 isadhesive and is attached to the fourth surface S4.

When a force F1 is exerted on the panel module to fix it on thesupporting surface 112 of the frame 110, the thicker center part of theadjusting pad 130 will first contact with the substrate 122. During thetime that the panel module 120 is continuously pressed, the thicker partof the adjusting pad 130 provides a reactive force F2 upwardly pushingthe downwardly flexural part of the substrate 122, thus leveling thesubstrate 122. Therefore, as FIG. 3B shows, when the two sides of thesubstrate 122 are attached to the exposed second surface S2 of the firstbase material 133, the flatness of the substrate 122 is well improved.The downgrade of the display quality of the display apparatus 100 (asshown in FIG. 1) caused from the flexure of the substrate 122 can beprevented.

In this embodiment, at least one of the chips 124 has a projection whichis completely projected onto the top substrate of the adjusting pad 130.In other words, the length of the third base material 133 is larger thanor equal to the length of the single chip 124, and the width of thethird base material 133 is larger than or equal to the width of thesingle chip 124. Besides, all the chips 124 are disposed over the secondbase material 132. In addition, the first base material 133 on thebottom can use light shielding material as a light shielding layer forpreventing light leakage from the edge of the substrate 122.

It should be mentioned that although the adjusting pad 130 has threebase materials in this embodiment, however, the number of the basematerials is not limited thereto. The number of the base materials canbe adjusted according to the degree of the flexure of the substrate 122.Besides, since the frame 110 of the invention is a component used forcarrying the panel module 120, the specific structure of the frame isnot limited.

Referring to FIG. 1, in an embodiment that the panel module 120 is anon-self emitting panel module (such as a liquid crystal panel module),the display apparatus 100 can further include a backlight module 140disposed below the panel module 120 for providing the light needed bythe panel module 120. The backlight module 140 can include lightemitting devices, light guiding plates and optical films. In otherembodiment that the panel module 120 is a self emitting panel module(such as an organic light emitting panel module), or a reflective panelmodule (such as an electrophoretic panel module or an electrowettingpanel module), the backlight module 140 can be omitted. Besides, inaddition to dispose the adjusting pad 130 between the supporting surface112 and the bonding region 123, in case the flexure is occurred at theother side of the substrate 122, the adjusting pad 130 can be disposedbetween the flexural side portion of the substrate 122 and thesupporting surface 112.

FIG. 4 is a schematic view of a display apparatus according to anotherembodiment of the invention. Referring to FIG. 4, which is similar toFIG. 3B, only the substrate 122 and the chips 124 are used to representthe panel module, and the supporting surface 112 is used to representthe frame. The structure and advantages of display apparatus 100 a ofthis embodiment is similar to that of the display apparatus 100 of theabove mentioned embodiment. The difference is that the first surface S1of the first base material 133 a of the adjusting pad 130 a isnonadhesive. A double sided tape 150 is disposed between the firstsurface S1 of the adjusting pad 130 a and the supporting surface 112 forattaching the first surface S1 to the supporting surface 112. Besides,two ends of the first base material 133 a are, for example, furtherbended to the bonding region 123, and the second surface S2 of the firstbase material 133 a is, for example, adhered to the bonding region 123and the back surface 125 of the substrate 122.

FIG. 5 is a schematic view of a display apparatus according to anotherembodiment of the invention. Referring to FIG. 5, which is similar toFIG. 3B, only the substrate 122 and the chips 124 are used to representthe panel module, and the supporting surface 112 b is used to representthe frame. The structure and advantages of display apparatus 100 b ofthis embodiment is similar to that of the display apparatus 100 of theabove mentioned embodiment. The difference is that the frame of theembodiment has a first adjusting pad 113 protruding from the supportingsurface 112 b. The first adjusting pad 113 is located between thesupporting surface 112 b and the bonding region 123. The frame is, forexample, a metal frame. The first adjusting pad 113 can be formed bypunching the frame. The function of the first adjusting pad 113 issimilar to the function of the above mentioned adjusting pad 130 and isnot repeated herein. Besides, the display apparatus 100 b can furtherinclude an adhering portion 160 attached between the supporting surface112 b and the substrate 122. The adhering portion 160 is located at twosides of the first adjusting pad 113. The adhering portion 160 is, forexample, a double sided tape for fixing the substrate 122 to thesupporting surface 112 b. Besides, the display apparatus 100 b caninclude the above mentioned backlight module according to the type ofthe panel module.

In another embodiment, as FIG. 6 shows, in addition to directly form thefirst adjusting pad 113 on the frame, a second adjusting pad 170 canfurther be attached to the supporting surface 112 b. The secondadjusting pad 170 is located at two sides of the first adjusting pad 113and bears against the first adjusting pad 113. A top surface 171 of thesecond adjusting pad 170 facing the substrate is lower than a topsurface 114 of the first adjusting pad 113 facing the substrate. Inother words, the thickness or height of the second adjusting pad 170 issmaller than the thickness or height of the first adjusting pad 113.Considering the degree of the flexure of the substrate, a thirdadjusting pad (not shown) having thickness thinner than the secondadjusting pad 170 can be disposed adjacent to two sides of the secondadjusting pad 170. Moreover, a fourth adjusting pad (not shown) havingthickness thinner than the third adjusting pad can be disposed adjacentto two sides of the third adjusting pad. Alternatively, a plurality ofbase material s can be stacked as the above mentioned embodiment to formthe second adjusting pad with different thickness.

In conclusion, in the display apparatus of the invention, the adjustingpad can be used to bear against the flexural portion of the substrateand level the substrate, such that the downgrade of the display qualityof the display apparatus caused from the flexure of the substrate can beprevented.

While the invention has been described in terms of what is presentlyconsidered to be the most practical and preferred embodiments, it is tobe understood that the invention needs not be limited to the disclosedembodiment. On the contrary, it is intended to cover variousmodifications and similar arrangements included within the spirit andscope of the appended claims which are to be accorded with the broadestinterpretation so as to encompass all such modifications and similarstructures.

What is claimed is:
 1. A display apparatus comprising: a frame having asupporting surface; a panel module comprising: a substrate disposed onthe supporting surface and the substrate having a bonding region at aside thereof, a plurality of chips disposed on the bonding region,wherein the chips and the bonding region are located on the supportingsurface, and the chips and the supporting surface are respectivelylocated at two opposite surfaces of the substrate; and an adjusting paddisposed between the supporting surface and the bonding region, and thethickness of the adjusting pad being gradually reduced from the centertoward the two sides thereof.
 2. The display apparatus as claim 1,wherein the adjusting pad comprises a plurality of base materials, thebase materials are stripe shaped and sequentially stacked, and thelength of the under base material is longer than the length of the upperbase material for any two adjacent base materials.
 3. The displayapparatus as claim 2, wherein the under base material has two sideregions being not overlapped by the upper base material for any twoadjacent base materials.
 4. The display apparatus as claim 2, wherein atleast one of the chips has a projection being completely projected ontothe top base material of the adjusting pad.
 5. The display apparatus asclaim 2, wherein the base materials at least has a first layer, a secondlayer and a third layer, the second layer is disposed on the firstlayer, and the third layer is disposed on the second layer, the firstlayer has a first surface and a second surface opposite to each other,the second layer has a third surface and a fourth surface opposite toeach other, the third layer has a fifth surface and a sixth surfaceopposite to each other, the first surface faces the supporting surface,the second surface is adhesive, and the third surface is attached to thesecond surface, the fourth surface and the sixth surface arenonadhesive, the fifth surface is adhesive and is attached to the fourthsurface.
 6. The display apparatus as claim 5, wherein the first surfaceis adhesive and is attached to the supporting surface.
 7. The displayapparatus as claim 5, further comprising a double sided tape disposedbetween the first surface and the supporting surface, wherein the firstsurface is nonadhesive, and the first surface is attached to thesupporting surface with the double sided tape.
 8. The display apparatusas claim 7, wherein two ends of the first base material are furtherbended to the bonding region and the second surface is attached to thebonding region.
 9. The display apparatus as claim 5, wherein the chipsare completely disposed over the second base material.
 10. The displayapparatus as claim 5, wherein a back surface of the substrate isattached to a part of the second surface.
 11. The display apparatus asclaim 2, wherein the bottom base material is a light shielding layer.12. The display apparatus as claim 2, wherein the base materials areadhesive tapes.
 13. The display apparatus as claim 1, further comprisinga backlight module disposed below the panel module.
 14. A displayapparatus comprising: a frame having a supporting surface and a firstadjusting pad protruding from the supporting surface; and a panel modulecomprising: a substrate disposed on the supporting surface and thesubstrate having a bonding region at a side thereof, the first adjustingpad located below the bonding region, a plurality of chips disposed onthe bonding region, wherein the chips and the supporting surface arerespectively located at two opposite surfaces of the substrate.
 15. Thedisplay apparatus as claim 14, wherein the frame is a metal frame andthe first adjusting pad is formed by punching the frame.
 16. The displayapparatus as claim 14, further comprising a second adjusting padattached on the supporting surface and located at two sides of the firstadjusting pad, wherein the thickness of the second adjusting pad issmaller than the thickness of the first adjusting pad.
 17. The displayapparatus as claim 14, further comprising an adhering portion attachedbetween the supporting surface and the substrate, and the adheringportion is located at two sides of the first adjusting pad.
 18. Thedisplay apparatus as claim 14, further comprising a backlight moduledisposed below the panel module.